How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process.
May 10, 2023
A solder ball is the most common type of defect that occurs in the SMT assembly process. Solder balls located within 0.13mm of traces
A solder ball is the most common type of defect that occurs in the SMT assembly process. Solder balls located within 0.13mm of traces
The importance of testing in PCB manufacturing cannot be overstated. With PCBs being used for mission critical operations, the integrity & smooth functioning of the PCB is
Mastering PCB Assembly: Step into the Future The PCB assembly process is a fascinating journey of precision, automation, and technology. Today, we’re going to
In SMT PCB production, solder paste printing is a critical step. Since the solder paste is used to directly form the soldering joint, the quality
From Prototype to Production: A Guide to High-Volume Electronics Manufacturing Today we’re diving deep into a topic that many electronics enthusiasts and professionals
Basic Concepts in PCB Design For many, PCB design can be an unfamiliar territory. This blog introduces the fundamental concepts and terminology you need to
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